Bonding Difficult Substartes Course
Every market has difficult to bond substrates. From high strength steels and new materials in transportation and electronics to plastics in medical and packaging. Selecting the chemical routes and mechanical processes for bonding substrates will depend significantly on the substrate properties and the assemblies containing them. The design must anticipate the range of mechanical and thermal stresses expected during the lifetime of the component. This course will address facets of cross-bonding between metals and polymeric material.
Learning Objectives
- Define several classes of difficult to bond substrates and/or environments
- Focus on metal-to-metal and cross-bonding to other substrates
- Review the importance and types of surface preparation
- Compare adhesive chemistries for specific substrates
- Learn what impacts bond durability and methods to improve
Dr. Kirk J. Abbey, Alkemere, LLC
Dr. Kirk Abbey is the President and Co-Founder of
Alkemere, LLC. Prior to that, he worked with the Lord Corporation as a Senior
Staff Scientist. He has thirty-seven years of experience in applied synthetic
chemistry of small molecules and polymers in support of industrial coatings and
adhesives. Efforts resulted in thirty-four issued U.S. patents plus at least
six pending U.S. patents and an official trade secret (deemed patentable, but
not filed). Additional numerous mechanistic investigations, including the application of semi-empirical quantum mechanics and density functional theory
methods. Dr. Abbey holds a B.A. in Chemistry from Rockford College, Illinois, and earned
his Ph.D. from Johns Hopkins University, Baltimore, Maryland.